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Wafer TEM Metrology Development Engineer

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Engineering
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JR-0000038506 Requisition #
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Responsible for developing advanced metrology solution for CD, profile, film thickness and topography using TEM/STEM, SEM, FIB (focused Ion Beam), and advanced Image Based Analysis.   Candidate is expected to work closely with heads process R&D engineers to develop the new metrology solution with advanced algorithm, and to support daily metrology measurement operation for all development projects.  Candidate will be part of  a R&D team that provide all aspects of metrology support for R&D of advanced magnetic recording heads process, and work in collaboration with the another dedicated manufacture metrology team.

Qualifications:
  • MS/PH.D degree in one of following areas: Physics, Materials Science, Data Science or other related science fields.
  • Have strong data analysis experience utilizing industry standard solutions.  
  • Experience with programming language such as MatLab, Python or other high level program languages for customized metrology algorithms development.
  • Experience in metrology technology such as TEM/STEM, FIB, SEM is a must.
  • Effective communication skill in all aspects.  Proficient in English in speaking, and writing.
  • Must be a team player.

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