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Senior Engineer, Packaging Engineering

JR-0000059573 Requisition #


Job Description




Seberang Perai Selatan, Pulau Pinang, Malaysia


510020018 SNDK SDSM SSD Penang Tech Development

SanDisk Storage Malaysia


Requisition #: JR-0000059573


Western Digital®


The next big thing in data is you!




  • Act as Subject Matter expert in the area on EWM, OTC and Material Management process as applicable to SAP ERP and associated Satellite applications
  • Work with the Packaging R&D group on modeling and simulation across semiconductor packaging, flash memory product, and host levels.
  • Responsible for influencing package and product design by addressing structural reliability issues particularly and advancing the technology of semiconductor packaging generally.
  • Scope is to address all mechanical aspects of packaging technology and associated material and process interactions.
  • Focus will be on solutions to meet increased demands for small form factor packages with thinner chips, denser interconnects and higher power.
  • Responsible for the modeling and simulation of mechanical responses of the IC package and flash products using analytical and computational tools.
  • Interface with package & product design, electrical and physical characterization, lab testing, failure analysis, assembly R&D and other process teams.





  • Solid background in applied mechanics and computational techniques is required. In-depth knowledge of IC packaging is highly desired.
  • M.S. in Mechanical Engineering required; Ph.D. in Mechanical Engineering preferred.
  • Solid knowledge through academic coursework or experience required in mechanical engineering of IC packaging and related areas.
  • Background in applied mechanics with emphasis on both analytical and computational methods.
  • Broad knowledge of mechanical behaviors of various material types, such as ceramics and glass, polymers, and metals (e.g., solder).
  • Working knowledge in using commercial FEA packages.
  • Working knowledge in scientific programming.
  • Good understanding of general semiconductor packaging processes, materials, technology and trends, such as substrate design and manufacturing, molding, wire-bonding, die attach, flip chip, etc.



  • Strong oral and written communication skills.
  • Demonstrated strong work ethic.
  • Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.







The future. It’s on you. You & Western Digital.

We’ve been storing the world’s data for more than 50 years. Once, it was the most important thing we could do for data. Now we’re helping the world capture, preserve, access and transform data in a way only we can.

The most game-changing companies, consumers, professionals, and governments come to us for the technologies and solutions they need to capture, preserve, access, and transform their data.


But we can’t do it alone. Today’s exceptional data challenges require your exceptional skills. It’s You & Us. Together, we’re the next big thing in data.


Western Digital® data-centric solutions are found under the G-Technology™, HGST, SanDisk®, Tegile™, Upthere™, and WD® brands.


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