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Packaging Simulation Engineer

JR-0000053972 Requisition #

Job Description

Staff Engineer, packaging Engineering

Minhang, Shanghai, China


SanDisk Information Technology (Shanghai) Co., Ltd.

Requisition ID: JR-0000053972


Western Digital®


The next big thing in data is you!


·       As a packaging simulation engineer, you will work in the Packaging R&D group on modeling and simulation across semiconductor packaging, flash memory product, and host levels.

·       In this position, you will be responsible for influencing package and product design by addressing structural reliability issues particularly and advancing the technology of semiconductor packaging generally.

·       Scope is to address all mechanical aspects of packaging technology and associated material and process interactions.

·       Focus will be on solutions to meet increased demands for small form factor packages with thinner chips, denser interconnects and higher power.

·       Candidate will be responsible for the modeling and simulation of mechanical responses of the IC package and flash products using analytical and computational tools.

·       This position will interface with package & product design, electrical and physical characterization, lab testing, failure analysis, assembly R&D and other process teams.


Qualifications REQUIRED:

·       Ph.D. in mechanical engineering, or M.S. in Mechanical Engineering plus >3 years of relevant industrial experience.

·       Solid knowledge through academic coursework or experience required in mechanical engineering of IC packaging and related areas.

·       Strong background in applied mechanics with emphasis on both analytical and computational methods.

·       Broad knowledge of mechanical behaviors of various material types, such as ceramics and glass, polymers, and metals (e.g., solder).

·       Working knowledge in using commercial FEA packages.

·       Working knowledge in scientific programming.

·       Good understanding of general semiconductor packaging processes, materials, technology and trends, such as substrate design and manufacturing, molding, wire-bonding, die attach, flip chip, etc.

·       Strong oral and written communication skills.

·       Demonstrated strong work ethic.

·       Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.

·       Solid background in applied mechanics and computational techniques is required.

·       In-depth knowledge of IC packaging is highly desired.




The future. It’s on you. You & Western Digital.

We’ve been storing the world’s data for more than 50 years. Once, it was the most important thing we could do for data. Now we’re helping the world capture, preserve, access and transform data in a way only we can.

The most game-changing companies, consumers, professionals, and governments come to us for the technologies and solutions they need to capture, preserve, access, and transform their data.


But we can’t do it alone. Today’s exceptional data challenges require your exceptional skills. It’s You & Us. Together, we’re the next big thing in data.


Western Digital® data-centric solutions are found under the G-Technology™, HGST, SanDisk®, Tegile™, Upthere™, and WD® brands.


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