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9000002599 Requisition #
Western Digital®

The next big thing in data is you!

We create environments for you to thrive. The growing diversity of data creates an exponential amount of new possibilities – for the world, our company and you. You’ll be part of a team driving the innovations necessary to outpace new demands and challenges everywhere data lives, from sensors to mobile devices to the cloud. We’ve only started to scratch the surface of what data can do. You can help unlock its full potential.

We are seeking highly motivated students to join our engineering teams. We are recruiting for the following positions: 

  • 3D NAND Cell Device, Staff Engineer

This individual will be responsible for development of the future generation of 3D NAND flash. The work involves electrical characterizations of flash memory chips with the goal of improvement the Reliability & Performance of the Memory Cell. You will perform electrical measurements of various aspects of Memory Cell Reliability such as endurance, data- retention, program/read disturb etc. and compare it across devices from different process conditions followed by statistical data analysis. You will also work at root cause analysis of physical mechanism of cell reliability degradation and identifying their solutions that may comprise of optimizing electrical operation of memory cell as well as improvement of cell fabrication process.


This position requires a PhD degree in Electrical Engineering, Applied Physics, Materials Science or a similar program. In depth knowledge of semiconductor device physics and/or nanoelectronics, familiarity with advanced semiconductor processing technologies and knowledge in statistical methods for experimental design and data analysis.

  • Process Integration and Mechanical Simulation, Staff Engineer

This individual will focus on the development of 3D NAND memory technology with the assistant of simulation. Work with cross-function teams to address process integration issues, perform mechanical stress or semiconductor process simulation, and provide guidance for semiconductor process development, integration strategy, 3D NAND architecture design etc.


This position requires a PhD degree in Mechanical Engineering, Electrical Engineering, or a similar program. In depth understanding on solid mechanics, work/research experience on mechanical simulation with ANSYS mechanical tool, knowledge on semiconductor integration and process. Experienced on Synopsys topography simulation tool, knowledge on 3D NAND memory process integration, and strong programming skills with Python or experience with other programming languages


  • Process Engineering, Staff Engineer

This individual will be responsible in the area of semiconductor process engineering and work directly on new process modules, including materials research, and develop new process integrations schemes for 3D NAND memory technology. focus on utilizing thin film processing techniques such as Chemical Vapor Deposition (CVD), Atomic Layer Deposition/Etching (ALD/ALE), Reactive Ion Etching (RIE), Rapid Thermal Processing (RTP) and Oxidation to fabricate semiconductor memory devices. Process development will also include Research & Development on unique processes and materials. Collecting structural analysis such as SEMs/TEMs and analyzing many forms of process data from experimental splits using statistical analysis software and conducting process optimization using design of experiments (DOE) will be required.


This position requires a PhD degree in Materials Science, Chemical Engineering, or a similar program with semiconductor fabrication background. Knowledge and experience with Metrology and Optical characterization techniques is also desired. The individual should have some academic knowledge of fundamental device physics and processing that are used in the semiconductor industry (RIE, Lithography, Thin Films, Metrology etc.) so that they can solve process related issues.

  • Device Engineering, Staff Engineer

This individual will study and optimize state of the art of 3D NAND flash devices, characterize memory cells and arrays, evaluate their reliability, optimize operating methods and parameters, and invent new solutions to tackle challenging problems. Further duties include evaluating flash management algorithms and assessing their impact on system operations. You will work closely with engineers from process, design, device, product, test, and system engineering groups.


This position requires a PhD in Electrical Engineering, Applied Physics or a similar program. A strong background in semiconductor physics, non-volatile memory device, and data analysis tools are highly desired.

  • 3D NAND Device, Staff Engineer

This individual will develop CMOS and compact models for 3D NAND flash memory, characterize and analyze test structures on wafer, develop active transistors and passive resistors/capacitor models, work with CMOS team to define CMOS targets and electrical design rules to develop and optimize transistor performance. Examine CMOS variation in fab and provide feedback on the model and design.


This position requires a PhD in Electrical Engineering, Applied Physics, Materials Science or a similar program. In-depth knowledge in semiconductor device physics, CMOS scaling and semiconductor process technology is needed. Working knowledge of basic analog/digital circuits is preferred.

  • 3D NAND Device, Staff Engineer

This individual will be responsible for the development of future 3D NAND flash technology, characterizations of flash memory, reliability & performance improvement. The work includes but not limited to: measurements of cell reliability and performance and statistical data analysis across devices from different process conditions, optimizing the parameter and NAND Flash operation modes, root cause analysis of cell reliability issues and identifying their solutions, and working closely with engineers from process, different device groups, design, PETE and system group for the integration of technology and production.


This position requires a PhD in Electrical Engineering, Applied Physics, Materials Science or a similar program. In-depth knowledge in semiconductor device physics and microelectronic theory, CMOS integrated circuit and semiconductor process technology, non-volatile memory design, physical analysis and technology scaling, MOSFET and memory device parameter tuning to improve performance and reliability are highly desired.


What is the Launch Program? The Launch Program is supplemental to your full-time engineering role. You will automatically participate in the LAUNCH program during the first twelve months. In this program, you will take a deeper dive into professional life at Western Digital by getting exposure to different parts of the organization, in addition to the experience you gain from your day-to-day responsibilities. Supplemental LAUNCH program elements include:

  • On the job training and mentorship with industry professionals
  • Supplemental professional development trainings
  • Executive exposure
  • Networking events with other Western Digital employees
  • Competitive compensation and benefits package

Milpitas, California, United States

San Jose, California, United States


  • Current student, pursuing a PhD degree graduating between December 2020 and June 2021
  • Minimum of 3.0 GPA cumulative
  • Exceptional written and verbal communication skills
  • Strong technical skills in area of study
  • Interest in HDD, flash, semiconductor, components, nonvolatile memory industry
  • Proficient in Microsoft Office applications 
  • Desired: 3 or more publication in area of study 

The future. It’s on you. You & Western Digital.

We’ve been storing the world’s data for more than 50 years. Once, storage was the most important thing we could do for data. Now, we’re helping the world capture, preserve, access and transform data in a way only we can.

The most game-changing companies, consumers, professionals, and government organizations come to us for the technologies and solutions needed to bring meaning and value to their ever-increasing diversity of data.

But we can’t do it alone. Today’s exceptional data challenges require your unique skills. You can be the next big thing in data. 

Western Digital® data-centric solutions are comprised of the Western Digital, G-Technology™, SanDisk® and WD® brands.

Western Digital is an equal opportunity employer. 

Western Digital does not discriminate on the basis of race, color, ancestry, religion (including religious dress and grooming standards), sex (including pregnancy, childbirth or related medical conditions, breastfeeding or related medical conditions), gender (including a person’s gender identity, gender expression, and gender-related appearance and behavior, whether or not stereotypically associated with the person’s assigned sex at birth), age, national origin, sexual orientation, medical condition, marital status (including domestic partnership status), physical disability, mental disability, medical condition, genetic information, protected medical and family care leave, Civil Air Patrol status, military and veteran status, or other legally protected characteristics. We also prohibit harassment of any individual on any of the characteristics listed above. Our non-discrimination policy applies to all aspects of employment. We comply with the laws and regulations set forth in the "Equal Employment Opportunity is the Law" poster.  

Western Digital participates in the E-Verify program in the US. For more information click here. Este empleador participa in E-Verify.

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